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EOE-W55 Datasheet [EN]

Overview

EOE-W55 combines an Espressif ESP32-S3 application processor with the WIZnet W5500 Hardwired TCP/IP Ethernet controller. The two devices communicate over SPI, while the ESP32-S3 provides Wi-Fi, Bluetooth LE, USB, and general-purpose peripheral interfaces.

note

This page describes the current pre-release hardware definition. Final pin allocation, current consumption, and production ratings remain subject to confirmation.

Key Features

  • ESP32-S3 dual-core Xtensa LX7 processor up to 240 MHz
  • Wi-Fi 4 / 802.11 b/g/n at 2.4 GHz and Bluetooth LE
  • W5500 Hardwired TCP/IP controller connected over SPI
  • 10/100Base-T Ethernet MAC and PHY
  • TCP, UDP, ICMP, IPv4, ARP, IGMP, and PPPoE processed in hardware
  • 8 independent hardware sockets
  • 32 KB internal TX/RX buffer memory
  • SPI modes 0 and 3, up to 80 MHz at the W5500 interface
  • Native USB and UART0 for programming and debug
  • GPIO, ADC, I2C, and SPI expansion interfaces
  • 18.3 × 26.15 mm module with 1.1 mm pin pitch

W5500 Ethernet Controller

ItemSpecification
Host interfaceSPI mode 0 or 3
Maximum SPI clock80 MHz
Hardware sockets8
Internal packet buffer32 KB for TX/RX
Network protocolsTCP, UDP, ICMP, IPv4, ARP, IGMP, PPPoE
Ethernet10Base-T / 100Base-TX with auto-negotiation
Power featuresPower-down mode and Wake-on-LAN over UDP

Module Interfaces

InterfaceFunction
EthernetW5500 Ethernet MDI signals for external RJ45 magnetics
WirelessESP32-S3 Wi-Fi and Bluetooth LE through the antenna connector
USBNative ESP32-S3 USB for programming and debug
UARTUART0 transmit and receive
ExpansionGPIO, ADC, I2C, and SPI
Ethernet statusLink, activity, speed, and duplex status outputs

Design Notes

  • Keep the W5500 SPI connection short and follow the released reference schematic.
  • Provide external RJ45 magnetics or a magnetics-integrated RJ45 jack on the carrier board.
  • Size the 3.3 V supply for ESP32-S3 Wi-Fi transmit-current peaks.
  • Treat ESP32-S3-facing external I/O as 3.3 V and not 5 V tolerant.

Pending Information

  • Final pinout and mechanical drawing
  • Module current consumption and thermal characterization
  • Certification and production ordering information
  • Reference schematic, BOM, and 3D model