Datasheet
Datasheet History
| Version | Date | Description |
|---|---|---|
| 1.0.0 | 2013-08-01 | Initial Release |
| 1.0.1 | 2013-09-13 | Corrected duplicated statements and typing errors (P.14, 23, 24, 28, 39, 51) Corrected descriptions (P.35) |
| 1.0.2 | 2013-11-14 | Changed “descriptions of pin at 1.1 Pin Descriptions” (P.10) starting ”It must be tied to GND to NC (PIN38..42)” 2. corrected typing error: starting “0x02 to 0x42 value of SOCK_MACRAW at 4.2 Socket Registers(P.50)” |
| 1.0.3 | 2014-05-29 | Corrected “Sn_MSSR at 4.2 Socket Register” (P.53): wrong descriptions of Sn_MSSR about FMTU/MTU |
| 1.0.4 | 2014-06-13 | 1. Added Note about reading size register value (P.56, 58) 2. Added IR Reflow Temperature Profile (P.66) |
| 1.0.5 | 2014-11-11 | 1. Added description for MISO pin (P.11):The SCSn signal defines MISO pin output value 2. Modified the register notation (P.33), Modified the register notation “Sn_IR at 4.2 Socket Register” (P.49) :from [R] to [RCW1] 3. Corrected typing error: from DICON to DISCON of Sn_SR at 4.2 Socket Register (P.50) |
| 1.0.6 | 2014-12-30 | Corrected typing error : from 0x02 to 0x42 value of SOCK_MACRAW “Sn_CR at 4.2 Socket Registers”(P.46) |
| 1.0.7 | 2016-02-24 | 1. Corrected Interrupt Assert Wait Time function (P.34) 2. Notice PLLclk is 150MHz (P.34) |
| 1.0.8 | 2017-05-19 | 1. Corrected Driver Level Range Unit uW/MHz to uW (P.60) |
| 1.0.9 | 2019-05-22 | 1. Corrected Sn_IMR Description (P.55) 2. Corrected Junction temperature Min value TJ (P.57) 3. Added Maximum junction temperature TJMAX (P.58) |
| 1.1.0 | 2022-11-17 | 1. Modify Pull-Up Resister Min Value RPU (P.59) 2. Updated latest Package Descriptions (P.64) |
WIZ550io History
| Version | Date | Description |
|---|---|---|
| 1.0 | 2013-08-01 | Initial Release |
| 1.1 | 2014-01-17 | Changed "External Transformer + RJ-45 to MAGJACK(inside transformer)" |
| 1.2 | 2015-04-20 | Added “Resistor 33R in MDI line. because EMI issue.” Changed "PCB artwork. because changed develop tool(PADS -> Altium) " |
| 1.3 | 2018-08-10 | Modified "inner 2 layer copper foil (3V3D). This copper foil plated below of CHAND area. It may affect ESD." |